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Patents Granted to Inventors From Vermont

A breakdown of Vermont inventors — lead inventors, collaborating inventors, and Vermont inventors who received patents owned by entities outside of Vermont. Inventors are presented alphabetically organized by location.

Want to Read the Patents? The icons following the patent number provide links to the text version of the patent at USPTO () and to the corresponding published pdf version (). Learn more about how the names of entities are handled by going to The Way Better Approach page.

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First-Named (Lead) Vermont Inventors

The Official Count — Patents granted to Vermont based first-named inventors. The icons following the patent number provide links to the text version of the patent at USPTO () and to the corresponding published pdf version ().


Icon Legend:   Chemical    Electrical    Mechanical    Design    Life Sciences
Inventor
Location
Company Patent Title
Timothy H. Daubenspeck
Colchester
GLOBALFOUNDRIES INC.9165850
 
 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
Timothy H. Daubenspeck
Colchester
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Alan B. Botula
Essex Junction
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications
Ethan H. Cannon
Essex Junction
GLOBALFOUNDRIES INC.9165917
 
 In-line stacking of transistors for soft error rate hardening
Dingrong Bai
Rutland
ACCORDANT ENERGY, LLC9162231
 
 Systems and methods for producing engineered fuel feed stocks from waste material

Collaborating Inventors on Vermont Patents

Other Vermont inventors who appeared on patents in the Official Vermont Count.

Icon Legend:   Chemical    Electrical    Mechanical    Business Methods    Design    Broad Business Methods    Life Sciences
Inventor
Location
Company Patent Title
Christopher D. Muzzy
Burlington
GLOBALFOUNDRIES INC.9165850
 
 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
Charles F. Musante
Burlington
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Christopher D. Muzzy
Burlington
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Jeffrey E. Hanrahan
Burlington
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications
Wolfgang Sauter
Hinesburg
GLOBALFOUNDRIES INC.9165850
 
 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
Dale W. Martin
Hyde Park
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications
James A. Slinkman
Montpelier
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications
Wolfgang Sauter
Richmond
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Mark D. Jaffe
Shelburne
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications
Timothy D. Sullivan
Underhill
GLOBALFOUNDRIES INC.9165850
 
 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
Timothy D. Sullivan
Underhill
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Jeffrey P. Gambino
Westford
GLOBALFOUNDRIES INC.9165850
 
 Compensating for warpage of a flip chip package by varying heights of a redistribution layer on an integrated circuit chip
Jeffrey P. Gambino
Westford
GLOBALFOUNDRIES INC.9165831
 
 Dice before grind with backside metal
Alvin J. Joseph
Williston
GLOBALFOUNDRIES INC.9165819
 
 High linearity SOI wafer for low-distortion circuit applications

Vermont Inventors on Patents from Other States

Vermont inventors were included on the innovation teams from other states that received patents this week.

Icon Legend:   Chemical    Electrical    Mechanical    Business Methods    Design    Broad Business Methods    Life Sciences
Inventor
Location
Company Patent Title
Matthew E. Broomhall
Burlington
International Business Machines Corporation9167009
 
 Presenting data to electronic meeting participants
Robert R. Robison
Colchester
GLOBALFOUNDRIES INC.9165944
 
 Semiconductor device including SOI butted junction to reduce short-channel penalty
Robert S. Horton
Colchester
INTERNATIONAL BUSINESS MACHINES CORPORATION9164908
 
 Managing out-of-order memory command execution from multiple queues while maintaining data coherency
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